GOLDEN BLUE 2PCS Soldering Lugs Solder Piece Rework Pad Welding Point Repair for Phones IC Pad Touch BGA PCB Fingerprint Welding Plates

• 1.Replace the tradional circling of jump wire to filled the missing solder joint ,restore to the original pad and without trace 2.The pads are reinforced with fixed pins and will never fall off
• 3.It adopts industrial-grade printed circuit board copper foil with a thickness of 30μm 4.Good flatness,which can prevent pseudo soldering effectively caused by unevenness
• 5.The connection joint with the circuit is firm ,and can fixed the green oil(UV curing solder mask ink)well
• 6.It saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high
• 7.The BGA bonding surface has saturation ,stable electrical performance ,good welding strength ,and it is not easy to drop off and unsoldering.

• Prepare the Damaged Pad — Carefully clean the dot-faded soldering pad on the PCB or phone motherboard. Ensure the area is free from debris, old solder, and flux residue for optimal adhesion.
• Apply the Soldering Lug — Select the appropriate GOLDEN BLUE soldering lug and position it precisely over the damaged pad area. The fixed pins help secure the lug in place, preventing movement during soldering.
• Solder and Secure — Apply flux and carefully solder the lug to the circuit board. The industrial-grade copper foil ensures good flatness and stable electrical performance. Once soldered, apply UV curing solder mask ink to secure the connection.

Typical situations where GOLDEN BLUE 2PCS Soldering Lugs Solder Piece Rework Pad Welding Point Repair for Phones IC Pad Touch BGA PCB Fingerprint Welding Plates helps — illustrative scenarios, not customer reviews.