GENNEL G109 Thermal Conductive Glue 10g (0.35 oz) | Industrial Silicone Adhesive for Heat Dissipation

• Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
• Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
• It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
• Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
• Package Includes : 1 x GENNEL G109 10g thermal glue

• Prepare Surfaces — Ensure the surfaces of both the component (e.g., chipset, LED) and the heatsink are clean, dry, and free from dust, oil, or old thermal paste residue. Use isopropyl alcohol for thorough cleaning.
• Apply Glue — Apply a thin, even layer of GENNEL G109 thermal conductive glue to one of the surfaces. Avoid excessive amounts, as a thin layer ensures optimal thermal transfer. Do not use between CPU and heatsink.
• Assemble and Cure — Press the heatsink firmly onto the component to ensure good contact. Allow the glue to cure fully for 24 hours at room temperature before powering on the device for maximum adhesion and thermal performance.

Typical situations where GENNEL G109 Thermal Conductive Glue 10g (0.35 oz) | Industrial Silicone Adhesive for Heat Dissipation helps — illustrative scenarios, not customer reviews.